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Case details

Case Number: App_462357/2023

  • Patent number:
    EP2183793 - NICKEL TIN BONDING SYSTEM WITH BARRIER LAYER FOR SEMICONDUCTOR WAFERS AND DEVICES

  • Proceeding type: Application

  • Action/Application: Opt-out

  • Applicants:
    Annabel Beacham Represented by Annabel Beacham

  • Court Division: appealInstance - seat - Luxembourg

  • Date of Formal receipt: 2023-06-01 11:16:49