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Case details

Case Number: App_472281/2023

  • Patent number:
    EP4017663 - THERMALLY DECOMPOSING BUILD PLATE FOR FACILE RELEASE OF 3D PRINTED OBJECTS,
    EP3931364 - HIGH RELIABILITY LEADFREE SOLDER ALLOYS FOR HARSH SERVICE CONDITIONS,
    EP3962689 - SOLDER PREFORM WITH INTERNAL FLUX CORE INCLUDING THERMOCHROMIC INDICATOR,
    EP3972776 - LOW TEMPERATURE MELTING AND MID TEMPERATURE MELTING LEAD-FREE SOLDER PASTE WITH MIXED SOLDER ALLOY POWDERS,
    EP4142978 - LEAD-FREE SOLDER PASTE WITH MIXED SOLDER POWDERS FOR HIGH TEMPERATURE APPLICATIONS

  • Proceeding type: Application

  • Action/Application: Opt-out

  • Applicants:
    Barker Brettell LLP Represented by Lucy Petra Trueman

  • Court Division: appealInstance - seat - Luxembourg

  • Date of Formal receipt: 2023-06-02 17:08:00